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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 tsz22111 ? 14? 001 www.rohm.com datashee t system power supply ics for automotive camera modules camera module system power supply ics for cmos sensor BD8682MUV-M general description BD8682MUV-M is a power supply for a camera module that is connected directly to the battery voltage. ldos for the cmos sensor, a dc/dc converter for the isp and a wide input range step-down dc/dc converter are integrated. furthermore, be cause of its integrated variable output functionality, it can be used with various configurations of cmos sensors and isp. BD8682MUV-M is available in vqfn32sv5050 package, making it ideal for small camera modules. features ? ch1: integrated high voltage type nch mosfet step-down dc/dc converter ( variable output voltage via external resistors) ? ch2: pch output ldo (selectable output: 2.8v or 3.3v) ? ch3: pch output ldo (selectable output: 1.8v or off) ? ch4: integrated pch mosfet step-down dc/dc converter. (selectable out put: 1.5v, 1.2v, 1.8v). ? synchronous rectification (ch1 and ch4) ? reset for ch2 ldo ? integrated overvoltage, undervoltage and overcurrent protection (10ms timer latch) ? 11ms off timer ? sequence control for all outputs ? small package: vqfn32sv5050 ? aec-q100 qualified key specifications ? input voltage range: 5.9v to 40v ? standby current: 10 a (max.) ? operating temperature range: -40 to +105 ? switching frequency (ch1): 500khz (typ.) ? switching frequency (ch4): 1mhz (typ.) ? output current (ch1): 500ma (max.) ? output current (ch2): 130ma (max.) ? output current (ch3): 60ma (max.) ? output current (ch4): 250ma (max.) package w (typ.) x d (typ.) x h (max.) vqfn32sv5050 5.00mm x 5.00mm x 1.00mm applications camera systems using cmos sensors such car cameras and surveillances cameras. typical application circuit application circuit schematic1 ss1 fb1 comp1 pgnd4 ss4 vo4 vcc pvcc4 en rsto vo2 pvcc2 gnd pvcc1 sw4 ss2 pgnd1 sw1 boot1 vreg50 vo1 +b vo4 5.0v vo3 ss3 (5.9v~18v) (1.5v, 1.2v, 1.8v) vo3 (1.8v) vo2 (2.8v, 3.3v) 4.7k rrst 51k rc1 2200pf cc1 2.4k (2k ) rfb2 7.5k rfb1 d1 l1 2200pf cfb1 cin 1f cin4 1f l4 10h co4 10f css4 0.01f co3 4.7f css3 0.01f c5 1f cin1 10f cb1 1f 22h co1 22f css1 0.047f cin2 1f co2 4.7f css2 0.01f l0 100h cin01 0.1f cin02 22f3 figure 1. application circuit schematic 1 vqfn32sv5050
datasheet datasheet 2/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M pin configuration pin description pin no. symbol function pin no. symbol function 1 pvcc1 power supply pin for ch1 dc/dc 17 ss2 soft start time setting pin for ch2 ldo 2 vcc power supply pin 18 vo2 output pin for ch2 ldo 3 en control pin (input for reverse signal) 19 pvcc2 power supply pin for ch2 ldo 4 test1 test pin 1 20 vo3 output pin for ch3 ldo 5 gnd ground pin 21 ss3 soft start time setting pin for ch3 ldo 6 vreg50 internal regulator output pin 22 ss4 soft start time setting pin for ch4 dc/dc 7 sel_t en mode setting pin 23 vo4 output voltage detection pin for ch4 dc/dc 8 sel_ch2 output voltage select pin for ch2 ldo 24 pgnd4 power ground pin for ch4 dc/dc 9 sel_ch3 output voltage select pin for ch3 ldo 25 sw4 output pin for ch4 dc/dc 10 sel_ch41 output voltage select pin 1 for ch4 dc/dc 26 pvcc4 power supply pin for ch4 dc/dc 11 sel_ch42 output voltage select pin 2 for ch4 dc/dc 27 ss1 soft start time setting pin for ch1 dc/dc 12 test2 test pin 2 28 fb1 error amp input pin for ch1 dc/dc 13 test3 test pin 3 29 comp1 error amp output pin for ch1 dc/dc 14 test4 test pin 4 30 pgnd1 power ground pin for ch1 dc/dc 15 test5 test pin 5 31 sw1 output pin for ch1 dc/dc 16 rsto reset output pin for ch2 ldo 32 boot1 bootstrap pin for ch1 dc/dc *test pins 1 through 5 should be connected to ground. sel pins should be connected to vreg50 or ground. figure 2. pin configuration (top view) 27 28 29 30 31 32 16 15 14 13 12 4 11 10 19 1 2 3 6 8 9 sw4 pvcc4 ss1 comp1 fb1 pgnd1 sw1 boot1 pgnd4 ss4 vo4 ss3 vo3 pvcc2 vo2 ss2 rsto test5 test4 test3 test2 test1 sel_ch42 sel_ch41 pvcc1 vcc en gnd vreg50 sel_t sel_ch2 sel_ch3 25 22 23 24 26 17 20 7 21 18 5
datasheet datasheet 3/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M block diagram ss1 slope fb1 comp1 pgnd4 ss4 slope vo4 drv logic counter tsd vcc pvcc4 en rsto vo2 pvcc2 gnd pvcc1 uvlo sel_t vref osc vreg50 drv logic uvlo50 protect off_latch ovd lvd ocp ctl uvlo sw4 ss2 pgnd1 sw1 boot1 vreg50 off latch timer ctl4 ctl1 ctl2 0.5v 0.8v 0.8v vo_select vo select reg ch1 swreg ch4 swreg vo3 ss3 ctl3 0.8v ch2 ldo ch3 ldo sequencer sequence ctl2 4 vo_select ctl4 uvlo tsd ctl1 uvlo tsd uvlo tsd uvlo tsd tsd vo select osc_d ctl ctl ctl1 reverse judgment off timer erramp pwm pwm erramp amp amp uvlo figure 3. block diagram
datasheet datasheet 4/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M description of blocks 1. reverse determination, off timer block ( sel_t pin ) when sel_t pin is high (connected to vreg50), ?reverse determination? and ?off timer? are activated. details are shown on page 12. (see timing chart 1) when sel_t pin is low (connected to gnd), ?reverse determinat ion? and ?off timer? are not ac tivated. therefore, en pin controls whether the circuit is on or off. (see timing chart 2) 2. sequencer (filter) en 300s filter 3ms filter camera on dc judge 1 pulse mask camera on frequency judge (en filter time1) (en filter time2) ctl1 sel_t 1 0 reset at circuit off time figure 4. sequencer block the sequencer block has a ?300 s filter? and a ?1 pulse mask? to counter noise from the en pin. the ?1 pulse mask? block is reset after 164ms (typ.). when the en signal pulse has too high a dut y cycle, i.e. the signal is not detect ed as a pulse by the above filter, the BD8682MUV-M will starts up in a dc determination. 3. output voltage select block (sel_ch2 to ch4) the output voltage of vo2, vo 3 and vo4 are selectable by sel_ch2, sel_ch3, sel_ch41 and sel_ch42 pin. each pin needs to be connected to vreg50 or gnd for a high or low signal respectively. 4. vreg50 block this block generates the 5v supply of the internal circuitry. this function requires an external buffer capacitor connected to the vreg50 pin. we recommend a ceramic capacitor of 1 f or higher, or one with low esr with short leads to vreg50 pin and ground is recommended. vreg50 has a uvlo function. the uvlo shuts off every out put and resets every timer (sequencer timer latch, and rsto delay time). note: vreg50 has a 100ma current capability (typ.). this is only to supply to the internal circuitry. not to supply to other circuitry. 5. timer latch block if the following protections are activated for 10ms, ?timer latch? is activated and the circuit is shut down as off latch. protections: overcurrent, overvoltage, short circuit (ch1) overcurrent, overvoltage, undervoltage (ch2, ch3, ch4) to release off latch, activate vcc uvlo or vreg50 uv lo or en or tsd. (see timing chart 6 on page.11) 6. tsd block in case power dissipation is continuously exceeded the chip tem perature (tj) will rise, tsd will be activated and all outputs and vreg50 will be turned off. the circuit will r eactive when the temperature drops down again. the output voltage and timer latch are reset when tsd is activated. sel_ch2 vo2 low 2.8v high 3.3v sel_ch3 vo3 low off high 1.8v sel_ch42 sel_ch41 vo4 low low 1.5v low high 1.2v high low 1.8v high high prohibit
datasheet datasheet 5/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M 7. protection blocks pin name protection function note vcc uvlo all outputs are turned of f reset of the off timer latch vreg50 uvlo all outputs are turned off reset of the off timer latch vo1 (sw1, fb1) ocp on duty limited every cycle sw1 on duty is limited and the output voltage lowered. ocp + timer latch off latch reset the off latch by uvlo, en or tsd scp + timer latch ovp ch1 internal fet is turned off ovp + timer latch off latch reset the off latch by uvlo, en or tsd pvcc2 pvcc4 ovp ch1 internal fet is turned off ovp + timer latch off latch reset the off latch by uvlo, en or tsd vo2 ocp + timer latch off latch reset the off latch by uvlo, en or tsd uvd + timer latch ovd + timer latch vo3 ocp + timer latch off latch reset the off latch by uvlo, en or tsd uvd + timer latch ovd + timer latch vo4 (sw4) ocp on duty is limited every cycle sw4 on duty is limited and the output voltage lowered. ocp + timer latch off latch reset off latch by uvlo, en or tsd uvd + timer latch ovd + timer latch other tsd all outputs and vreg50 are turned off auto recovery, release off timer latch (uvlo: undervoltage lockout circuit, ovd: overvoltage detection, uvd: undervoltage dete ction, ocp: overcurr ent protection, scp: short current protection, timer latch: typ.10ms, ovp: overvoltage protection, tsd: thermal shutdown)
datasheet datasheet 6/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M absolute maximum ratings parameter symbol ratings unit vcc pin voltage vcc -0.3 to 40 *1 v en pin voltage en -0.3 to 40 v pvcc1 pin voltage pvcc1 -0.3 to 40 *1*2 v vreg50 pin voltage vreg50 -0.3 to 6 *3 v boot1 pin voltage boot1 -0.3 to 45 v boot1-sw1 pin voltage boot1-sw1 -0.3 to 6 v sw1 pin voltage sw1 -0.3 to pvcc1 + 0.3 v pvcc2 pin voltage pvcc2 -0.3 to 6 *1 v pvcc4 pin voltage pvcc4 -0.3 to 6 *1 v sw4 pin voltage sw4 -0.3 to pvcc4 + 0.3 v ss pin voltage ss1 to 4 -0.3 to 6 *4 v fb pin voltage fb1 -0.3 to 6 *4 v comp pin voltage comp1 -0.3 to 6 *4 v vo2 pin voltage vo2 -0.3 to 6 *5 v vo3 pin voltage vo3 -0.3 to 6 *5 v vo4 pin voltage vo4 -0.3 to 6 *6 v rsto pin voltage rsto -0.3 to 6 *5 v sel_ch2 pin voltage sel_ch2 -0.3 to vreg50 + 0.3 v sel_ch3 pin voltage sel_ch3 -0.3 to vreg50 + 0.3 v sel_ch41 pin voltage sel_ch41 -0.3 to vreg50 + 0.3 v sel_ch42 pin voltage sel_ch42 -0.3 to vreg50 + 0.3 v sel_t pin voltage sel_t -0.3 to vreg50 + 0.3 v test pin voltage test1 to 5 -0.3 to vreg50 + 0.3 v power dissipation pd 0.88 *7 w storage temperature range tsts -55 to +150 maximum junction temperature tj +150 *1 pd should not be exceeded. *2 vcc-0.3v < pvcc1 < vcc+0.3v *3 should not exceed vcc+0.3v *4 should not exceed vreg50+0.3v *5 should not exceed pvcc2+0.3v *6 should not exceed pvcc4+0.3v *7 7.04mw/ reduction when ta R 25 , if mounted on a double layer pcb 70mm70mm1.6mm recommended operating rating(s) parameter min. max. unit vcc, pvcc1 5.9 18 v pvcc2, pvcc4 3.0 4.0 v sw1 load current - 500 ma vo2 load current - 130 ma vo3 load current - 60 ma sw4 load current - 250 ma operating temperature range -40 +105
datasheet datasheet 7/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M electrical characteristic(s) (unless otherwise specified, ta=25 , vcc=pvcc1=12v, pvcc2=pvcc4=3.3v, en=5v) parameter symbol limit unit condition min. typ. max. standby current i stb1 - 0 10 a en=0.0v circuit current i cc2 2.5 5.0 12.0 ma uvlo operating voltage of vcc v uvlo 4.3 4.6 4.9 v ta=-40 to 105 uvlo hysteresis voltage of vcc v uvlo_hys 500 750 990 mv ta=-40 to 105 vreg50 voltage vreg50 4.5 5.0 5.5 v uvlo operating voltage of vreg50 v uvlo50 3.5 3.8 4.1 v ta=-40 to 105 uvlo hysteresis voltage of vreg50 v uvlo50_hys 200 300 390 mv ta=-40 to 105 ch1, high voltage step-down dc/dc converter feedback reference voltages 1 vfb1 0.784 0.800 0.816 v fb1=comp1 voltage oscillator frequency 1 f osc1 0.4 0.5 0.6 mhz ss1 charge current i ss1 1.0 2.5 4.0 a v ss1 =0.5v ss1 cramp voltage v ss1clm 1.0 1.3 1.6 v ss1 protection circuit detection start voltage v ss1pon 1.0 1.3 1.6 v v ss1 voltage(l h) sw1 nmos overcurrent protection i ocp1 510 - - ma ch2, ldo 2.8v output voltage vo2_28 2.744 2.800 2.856 v ivo2=5ma, set_ch2=gnd 3.3v output voltage vo2_33 3.234 3.300 3.366 v ivo2=5ma, set_ch2=vreg50 pvcc2=3.8v discharge resistor r v2dis 200 400 600 ? en=0v, vo=2.8v ss2 charge current i ss2 1.0 2.5 4.0 a v ss2 =0.5v ss2 cramp voltage v ss2clm 1.0 1.3 1.6 v ss2 protection circuit detection start voltage v ss2pon 1.0 1.3 1.6 v vo2 undervoltage detection v uvd2 vo2 0.25 vo2 0.40 vo2 0.55 v v vo2 voltage( (h l) vo2 overvoltage detection v ovd2 vo2 1.35 vo2 1.50 vo2 1.65 v v vo2 voltage( (l h) ch2 pmos over current protection detection i ocp2 140 - - ma reset rsto detect voltage v rsto1 vo2 0.84 vo2 0.86 vo2 0.88 v v vo2 (h l) rsto release voltage v rsto2 vo2 0.89 vo2 0.93 vo2 0.97 v v vo2 (l h) rsto on resistance r rsto 50 100 150 ? i rsto =1ma rsto leakage current i rsto - 0 10 a rsto=5v rsto delay time t rsto 16 20 24 ms ch3, ldo 1.8v output voltage vo3_18 1.764 1.800 1.836 v ivo3=5ma, set_ch3=vreg50 pvcc2=3.8v discharge resistance r v3dis 200 400 600 ? en=0v, vo=1.8v ss3 charge current i ss3 1.0 2.5 4.0 a v ss3 =0.5v ss3 cramp voltage v ss3clm 1.0 1.3 1.6 v ss3 protection circuit detection start voltage v ss3pon 1.0 1.3 1.6 v vo3 undervoltage detection v uvd3 vo3 0.25 vo3 0.40 vo3 0.55 v v vo3 voltage (h l) vo3 overvoltage detection v ovd3 vo3 1.35 vo3 1.50 vo3 1.65 v v vo3 voltage (l h) ch3 pmos overcurrent protection i ocp3 70 - - ma * pd should not be exceeded.
datasheet datasheet 8/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M electrical characteristic(s) (unless otherwise specified, ta=25 , vcc=pvcc1=12v, pvcc2=pvcc4=3.3v, en=5v) parameter symbol limit unit condition min. typ. max. ch4, step-down dc/dc converter 1.5v output voltage vo4_15 1.470 1.500 1.530 v set_ch41=gnd set_ch42=gnd 1.2v output voltage vo4_12 1.176 1.200 1.224 v set_ch41=vreg50 set_ch42=gnd pvcc4=3.8v 1.8v output voltage vo4_18 1.764 1.800 1.836 v set_ch41=gnd set_ch42=vreg50 pvcc4=3.8v oscillator frequency 4 f osc4 0.8 1.0 1.2 mhz discharge resistor r v4dis 200 400 600 ? en=0v, vo4=1.5v ss4 charge current i ss4 1.0 2.5 4.0 a v ss4 =0.5v ss4 cramp voltage v ss4clm 0.7 1.0 1.3 v ss4 protection circuit detection start voltage v ss4pon 0.7 1.0 1.3 v vo4 undervoltage detection v uvd4 vo4 0.25 vo4 0.40 vo4 0.55 v v vo4 voltage(h l) vo4 overvoltage detection v ovd4 vo4 1.35 vo4 1.50 vo4 1.65 v v vo4 voltage(l h) sw4 pmos overcurrent protection i ocp4 260 - - ma sequencer ( reverse determination ) en filter time 1 t fil1 200 300 400 s for camera on frequency determination en filter time 2 t fil2 2.4 3 3.6 ms for camera on time determination off timer time off timer 10 11 12 s sel_t=vreg50 (ta = -40 to +105 ) camera on fast frequency fperiod_f 250 - 335 ms camera on slow frequency fperiod_s 60 - 80 hz camera on time(dc input) ton_time 24 30 36 hz en full down resistance ren 200 400 600 ms en input threshold voltage ven_ta 3.0 3.7 4.4 k ? other timer latch time tlatch 8 10 12 ms *pd should not be exceeded. sequencer range (sel_t=vreg50) 0 10 90 100 1 [hz] 13 [hz] 329 [hz] 29 60 [hz] 60 80 [hz] 80 250 [hz] 250 335 [hz] 335 400 [hz] 400 1000 [hz] 1000 [hz] ? duty [%] frequency reverse determination ng range all the outputs do not startup reverse determination ok (range all the outputs start up) undefined reverse determination (range all the outputs may start up) duty[%] 100 in case of t on_time , frequency [hz] the reverse determination is ok
datasheet datasheet 9/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M typical performance curve (reference data) figure 5. circuit current vs. power supply figure 6. circuit current vs. temperature figure 7. en threshold voltage vs. temperature figure 8. ss charge current vs. temperature 2.0 2.2 2.4 2.6 2.8 3.0 -40 -15 10 35 60 85 temperature[ ] ss charge current (i ss ) [a] 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 -40 -15 10 35 60 85 temperature[ ] en threshold voltage (ven_ta) [v] 0 1 2 3 4 5 6 -40 -15 10 35 60 85 temperature[ ] circuit current (icc2) [ma] 0 1 2 3 4 5 6 0 5 10 15 20 input voltage (vcc) [v] circuit current (icc2) [ma] -40 25 105 5.9v 12v 18v
datasheet datasheet 10/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M figure 9. 3.3v output voltage (ch1) vs. temperature figure 10. 2.8v output voltage (ch2) vs. temperature figure 11. 1.8v output voltage (ch3) vs. temperature figure 12. 1.5v output voltage (ch4) vs. temperature 1.70 1.75 1.80 1.85 1.90 -40 -15 10 35 60 85 temperature[ ] output voltage (vo3) [v] 1.40 1.45 1.50 1.55 1.60 -40 -15 10 35 60 85 temperature[ ] output voltage (vo4) [v] 2.65 2.70 2.75 2.80 2.85 2.90 2.95 -40 -15 10 35 60 85 temperature[ ] output voltage (vo2) [v] 3.15 3.20 3.25 3.30 3.35 3.40 3.45 -40 -15 10 35 60 85 temperature[ ] output voltage (vo1) [v] sel_ch3=vreg3 sel_ch41=gnd sel_ch42=gnd
datasheet datasheet 11/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M figure 13. vcc uvlo operating voltage vs. temperature figure 14. rsto detect voltage vs. temperature figure 15. frequency1, 4 vs. temperature figur e 16. frequency of osc_d vs. temperature 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -40 -15 10 35 60 85 temperature[ ] frequency1,4 (fosc1, fosc4) [mhz] 45 47 49 51 53 55 -40 -15 10 35 60 85 temperature[ ] frequency digital (f digital ) [khz] 2.30 2.35 2.40 2.45 2.50 -40 -15 10 35 60 85 temperature[ ] rsto detection voltage (v rsto1 ) [v] 4.3 4.4 4.5 4.6 4.7 4.8 4.9 -40 -15 10 35 60 85 temperature[ ] vcc uvlo (v uvlo ) [v] fosc1 fosc4
datasheet datasheet 12/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M timing chart i. timing chart at start up and shutdown(in case of sel_t = vreg50, sel_ch3=vreg50) (*: en filter time 1 is omitted.) figure17. timing chart 1 (start up and shutdown) ii. timing chart when start up and shutdown (in case of sel_t = gnd, sel_ch3=gnd) (*: en filter time 1 is omitted.) figure18. timing chart 2 (start up and shutdown)
datasheet datasheet 13/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M iii. operating pattern of camera on signal figure 19. timing chart 3 iv. timer latch release method sel_t=gnd vcc en vo1 latch cancel sel_t=vreg50 figure 20. timing chart 4 (release of the timer latch)
datasheet datasheet 14/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M v. ch1 protection function en vreg50 ss1 vo1 sw1 io1 *1 *2 *2 *1 *2 * 3 *2 *3 *1 *2 * 3 *2 t ovp < 10ms(typ.) t ovp R 10ms(typ.) uvlo release 0.8v(typ.) *3 uvlo release 0.8v(typ.) 0.8v(typ.) *1 *2 0.8v(typ.) *1 *2 tsd on tsd off timer latch latch cancelled by en timer latch timer latch output short output short latch cancelled by en latch cancelled by en uvlo release uvlo release auto-recovery t ocp < 10ms(typ.) t ocp R 10ms(typ.) t scp < 10ms(typ.) t scp R 10ms(typ.) *1: duty is controlled by soft start *2: normal switching operation *3: duty is limited every cycle. figure21. timing chart 5 (ch1 protection function) vi. ch2 protection function (the similar to ch3) timer latch output short en ss1 ss2 vo2 io4 0.8v(typ.) 0.8v(typ.) 0.8v(typ.) 0.8v(typ.) 0.8v(typ.) timer latch timer latch output short auto-recovery t ovd < 10ms(typ.) t ovd R 10ms(typ.) tsd on tsd off latch cancelled by en latch cancelled by en latch cancelled by en t ocp < 10ms(typ.) t ocp R 10ms(typ.) t uvd < 10ms(typ.) t uvd R 10ms(typ.) figure 22. timing chart 6 (ch2, 3 protection function) vii. ch4 protection function *1: duty is controlled by soft start *2: normal switching operation *3: duty is limited every cycle. figure 23. timing chart 7 (ch4 protection function)
datasheet datasheet 15/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M application examples sw4 pvcc4 ss1 fb1 comp1 pgnd1 sw1 boot1 pgnd4 ss4 vo4 ss3 vo3 pvcc2 vo2 ss2 rsto test5 test4 test3 test2 test1 sel_ch42 sel_ch41 pvcc1 vcc en gnd vreg50 sel_t sel_ch2 sel_ch3 1.5v 2.8v rrst l4 css1 cc1 rc1 rfb2 rfb1 cfb1 d1 l1 2200pf 51k 2.4k 7.5k 2200pf 4.7k 3.3v d0 vcc input filter +b co4 10 f cin4 1 f 10 h 0.047 f co1 22 f 22 h cb1 1 f cin1 10 f l0 100 h cin01 0.1 f cin02 22 f3 cin 1 f c5 1 f css2 0.01 f co2 10 f cin2 1 f css4 0.01 f figure 24. application circuit schematic 2 (sequencer disabled. vo1=3.3v, vo2=2.8v, vo3=not used, vo4=1.5v) note: in case of not using input filter, the value of output fluctuation increase for input voltage (+b) fluctuation. we recommend using input filter. details are shown on page 20. (see ?5. input filter?)
datasheet datasheet 16/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M sw4 pvcc4 ss1 fb1 comp1 pgnd1 sw1 boot1 pgnd4 ss4 vo4 ss3 vo3 pvcc2 vo2 ss2 rsto test5 test4 test3 test2 test1 sel_ch42 sel_ch41 pvcc1 vcc en gnd vreg50 sel_t sel_ch2 sel_ch3 1.2v 1.8v 3.3v +b rrst l4 css1 cc1 rc1 rfb2 rfb1 cfb1 d1 l1 2200pf 51k 2k 7.5k 2200pf 4.7k 3.8v d0 vcc input filter co4 10 f cin4 1 f 10 h 0.047 f co1 22 f 22 h cb1 1 f cin1 10 f l0 100 h cin01 1 f cin02 22 f3 cin 1 f c5 1 f css2 0.01 f co2 10 f cin2 1 f co3 10 f css3 0.01 f css4 0.01 f figure 25. application circuit schematic 3 (sequencer disabled. vo1=3.8v, vo2=3.3v, vo3=1.8v, vo4=1.2v) note: in case of not using input filter, the value of output fluctuation increase for input voltage (+b) fluctuation. we recommend using input filter. details are shown on page 20. (see ?5. input filter?)
datasheet datasheet 17/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M sw4 pvcc4 ss1 fb1 comp1 pgnd1 sw1 boot1 rsto test5 test4 test3 test2 sel_ch42 sel_ch41 sel_ch3 1.8v 1.8v 3.3v rrst l4 css1 cc1 rc1 rfb2 rfb1 cfb1 d1 l1 2200pf 51k 2k 7.5k 2200pf 4.7k 3.8v +b d0 vcc input filter cin4 1 f co4 10 f 10 h 0.01 f co1 22 f 22 h cb1 1 f cin1 10 f l0 100 h cin01 0.1 f cin02 22 f3 cin 1 f c5 1 f css2 0.01 f co2 10 f cin2 1 f co3 10 f css3 0.01 f css4 0.01 f figure 26. application circuit schematic 4 (sequencer disabled. vo1=3.3v, vo2=2.8v, vo3=1.8v, vo4=1.8v) note: in case of not using input filter, the value of output fluctuation increase for input voltage (+b) fluctuation. we recommend using input filter. details are shown on page 20. (see ?5. input filter?)
datasheet datasheet 18/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M parts list (recommendation) name value parts no size code manufacturer note ic - - BD8682MUV-M 5x5mm rohm rfb1 7.5 [k ? ] mcr03 series 1608 rohm rfb2 2.4 [k ? ] mcr03 series 1608 rohm in case of vo1=3.8v, rfb2 = 2.0k ? rc1 51 [k ? ] mcr03 series 1608 rohm rrst 4.7 [k ? ] mcr03 series 1608 rohm cin 1 [ f] c2012x7r1h105k 2012 tdk cin1 10 [ f] c3225x7r1h106k 3225 tdk cin2 1 [ f] c1608x7r1c105k 1608 tdk cin4 1 [ f] c1608x7r1c105k 1608 tdk co1 22 [ f] c3225x7r1c226m 3225 tdk co2 10 [ f] c2012x7r1a106k 2012 tdk co3 10 [ f] c2012x7r1a106k 2012 tdk co4 10 [ f] c2012x7r1a106k 2012 tdk c5 1 [ f] c1608x7r1c105k 1608 tdk css1 47 [nf] grm18 series 1608 murata css2 10 [nf] grm18 series 1608 murata css3 10 [nf] grm18 series 1608 murata css4 10 [nf] grm18 series 1608 murata cb1 1 [ f] c1608x7r1c105k 1608 tdk cfb1 2.2 [nf] grm18 series 1608 murata cc1 2.2 [nf] grm18 series 1608 murata l1 22 [ h] vlf302515m-220m-ca 3x2.5mm tdk l4 10 [ h] vlf302515m-100m-ca 3x2.5mm tdk d1 - - rb160ss-40 1608 rohm d0 - - rr264m-400 3.5x1.6mm rohm input filter l0 100 [ h] vlcf4024t-101m 4x4mm tdk cin01 0.1 [ f] grm188r11h104ka93 1608 murata cin02 22x3 [ f] grm32eb31e226k 3225 murata pcb layout pattern (top view) vcc vo4 vo3 vo2 rsto gnd en vo1 figure 27. board layout example (in case of applic ation circuit schematic 4. input filter excluded.) note: we recommend that the number of layers is 4 or more. in case of 4 layer, 2 nd layer is ground layer, and 3 rd layer is power supply layer.
datasheet datasheet 19/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M vref c ss i ss (2. 5 a typ.) selection of external components 1. setting the output voltage (vo1) the output 1 voltage is determined by the equation below. select a combination of rfb1 and rfb2 to obtain the required voltage. a small resistance value leads to a drop in power efficiency. rfb1 also affects the phase compensation of vo1. vo1 = vfb1 (rfb1 + rfb2) / rfb2 [v] moreover, vo1 voltage must be hi gher than vo2 voltage + 0.5v. example: in case of vo2 = 2.8v, vo1 R 3.3v. in case of vo2 = 3.3v, vo1 R 3.8v. note: vo2, vo3 and vo4 are fixed and selectable voltages. 2. setting the inductor (l1,l4) value the coil value significantly influences the output ripple current. as shown in the following equation, the larger the coil, and the higher the switching frequency, the lower the ripple current. figure 28. the optimal output ripple current setting is ca. 30% of the maximum current. il = 0.3ioutmax. [a] ( il: output ripple curren t, f: switching frequency) care should be taken to not exceed the maximum current rating of the inductor since this will lead to magnetic saturation and consequently to a loss of efficiency. it is recommended to allow for sufficient margin to ensure that the peak current does not exceed the coil current rating. use low resistan ce (dcr, acr) coils to minimize coil loss and increase efficiency. 3. setting the shottky barrier diode selection ? reverse voltage v r > pvcc1(=vcc) ? allowable current > output current + ripple current * a value higher than the overcurrent protection value is recommended. * select a diode with a low forward voltage and fast recovery for high efficiency. 4. setting the soft start time the soft start function is necessary to prevent inrush of coil current and output vo ltage overshoot at startup. t ss = [s] vref: ch1=0.8v (typ.), ch3=0.8v (typ.) , ch3=0.8v (typ.), ch4=0.5v (typ.) there is a possibility that an overshoot is generated in the output due to the phase compensation value, output capacitor, etc. therefore, verification and confi rmation with the actual application is recommended. use high accuracy components (e.g. x7r) when implementing sequential st artups involving other power sources. il (vcc-vout)vout ilvccf l = [h] (vcc-vout)vout lvccf il = [a]
datasheet datasheet 20/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M 5. input filter in case of not using input filt er, the values of output fluctuat ion increase for input voltage (+ b) fluctuation at 500hz or hig her frequency. we recommend using input filter. in case of using i nput filter, the values of output fluctuation reduce at 500hz or higher. the flowing graphs are output fluctuation vs. frequency. measurement condition: +b=12v2v (sin wave), io2=50ma, io4=100ma not using input filter using input filter figure 29. output fluctuation (n case of application circuit schematic 2) power dissipation 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 05 01 0 01 5 0 power dissipation: pd [w] ambient temperature: ta [ ] vqfn32sv5050 figure 30. power dissipation vs. temperature characteristics 1. stand alone ic power dissipation: 0.38 [w] 3.04mw/ reduction when ta R25 2. mounted on a rohm standard board ( 70mm70mm1.6mm glass-epoxy board) power dissipation: 0.88 [w] 7.04mw/ reduction when ta R25 2. mounted on a ro hm standard board 1. stand alone ic
datasheet datasheet 21/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M i/o equivalent circuits pvcc1,boot1,sw1,pgnd1 pvcc4,pgnd4,sw4 vcc,vreg50 en fb1 comp1 ss pvcc rsto vo2,vo3 vo4 figure 31. equivalent circuits pvcc1 gnd pgnd1 boot1 sw1 vcc gnd vreg50 fb1 gnd vreg50 vcc pvcc1 pvcc2 pvcc3 pvcc4 gnd vo4 gnd vo2 vo3 pvcc2 gnd vreg50 rsto gnd vreg50 ss14
datasheet datasheet 22/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M operational notes 1) absolute maximum ratings exceeding the absolute maximum rating for supply voltage, oper ating temperature or other parameters may result in damages to or destruction of the chip. in this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) reverse connection to the power supply connector a reverse connection to the power supply connector may re sult in damages to the ic. in order to prevent against reverse connection damages please use an external diode in series between the power supply and the power supply pin of the ic. 3) power supply line because there is a return of regenerat ed current caused by the back electrom otive force of the coil, please take countermeasures such as placing a bypass capacitor in the pa th of the regenerated current in close proximity of the supply ground pin of the ic. at low tem peratures the capacitance of the electrolytic capacitor might decrease. please give sufficient consideration to selecting suitable components. 4) gnd electric potential keep the gnd pin potential at the lowest (minimum) level under any operating conditi on. furthermore, ensure that, including the transient, none of the pin?s voltages are less t han the gnd pin voltage. also , excluding the sw pin, the voltage of all pins should nev er drop below that of gnd. 5) thermal design the power dissipation under actual oper ating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. 6) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betw een the output, input and gnd pin may result in damaging the ic. 7) operation in strong electromagnetic fields use caution when operating in the presence of strong electromagnetic fields, as this may cause the ic to malfunction. 8) output capacitor in some applications, the vcc and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, while the exte rnal capacitor is charged, vcc shorts to gnd. we also recommend using reverse polarity diodes in series between all pins and the vcc pin. 9) testing on application boards the ic needs to be discharged after each test process as, wh ile using the application board for testing, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 10) input pins this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with t he n layers of other elements, creating a parasitic diode or transistor. relations between each potential may form as shown in the example below, where a resistor and transistor are connected to a pin: ?with the resistor, when gnd pin a, and with the transistor (npn), when gnd pin b: the p-n junction operates as a parasitic diode. ?with the transistor (npn), when gnd pin b: the p-n junction operates as a parasitic transistor by intera cting with the n layers of elements in proximity to the parasitic diode described above. parasitic diodes inevitably occur in the structure of the ic . their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd figure 32. example of ic?s simple structure
datasheet datasheet 23/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M 11) ground wiring pattern when both a small-signal gnd and a high current gnd are present, single-point grounding (at the set standard point) is recommended. this in order to separate the small-si gnal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high curr ent do not cause any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component gnd. 12) thermal shutdown circuit this ic incorporates an integrated thermal shutdown circui t to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (tj) will rise and the tsd circuit will be activated and turn all output pins and vreg50 off. after the tj falls below the tsd threshold the circ uits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 13) test mode note that the ic will go into test mode when ss pins are supplied with 3v or more or when test pins are supplied any voltage. test pins must be conn ected gnd at normal operation. 14) vreg50 pin vreg50 is output that supplies the internal circuit. we do not recommend using vreg50 for any other purpose. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences between the translated and original version, the formal version takes priority
datasheet datasheet 24/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M ordering information b d 8 6 8 2 m u v me 2 part number package muv: vqfn packaging and forming specification m: automotive e2: embossed tape and reel physical dimension tape and reel information marking diagram vqfn32sv5050 (top view) bd8682 part number marking lot numbe r 1pin mark
datasheet datasheet 25/25 tsz02201-0t3t0am00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.nov.2013 rev.003 www.rohm.com tsz22111 ? 15? 001 BD8682MUV-M revision history date revision changes 22.oct.2012 002 new release 29.nov.2013 003 1page : addition ?aec-q100 qualified? at features
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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